Hüftkomponenten mit der Calcium-Phosphat-Schicht BONIT® für eine optimierte und schnellere Osseointegration

Electrochemical calcium phosphate layer: BONIT®

Calcium-phosphate-coated (BONIT®) cup
SEM pictures of BONIT® surface
SEM pictures of BONIT® surface

DOT video for BONIT®

Technology

BONIT® is an electrochemical coating technique developed by DOT that is used to apply a thin, resorbable calcium phosphate layer on orthopaedic implants.

Range of Application

  • Joint implants: hip joint, knee joint, ankle joint , shoulder joint, wrist joint, finger implants and spinal implants

Advantages of the Procedure

  • Microporosity with high capillarity
  • Complete and uniform coverage of porous surfaces and complex implant geometries
  • No flaking of particles or coating delaminations
  • Faster and better healing

Properties

  • Coating thickness: 20±10 µm
  • Porosity: 60 %
  • Adhesion strength: ≥ 15 MPa
  • Ca/P ratio: 1.1±0.1
  • Phase composition: ≥ 70 % Brushite/≤ 30 % HA
  • Complete resorption within a short period of time
    (6-12 weeks postoperatively)

Another calcium phosphate layer that we offer:

DOT GmbH
Charles-Darwin-Ring 1a
18059 Rostock l Germany

Phone: +49 381- 4 03 35-0

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