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Electrochemical calcium phosphate layer: BONIT®
SEM pictures of BONIT® surface
DOT video for BONIT®
Technology
BONIT® is an electrochemical coating technique developed by DOT that is used to apply a thin, resorbable calcium phosphate layer on orthopaedic implants.
Range of Application
- Joint implants: hip joint, knee joint, ankle joint , shoulder joint, wrist joint, finger implants and spinal implants
Advantages of the Procedure
- Microporosity with high capillarity
- Complete and uniform coverage of porous surfaces and complex implant geometries
- No flaking of particles or coating delaminations
- Faster and better healing
Properties
- Coating thickness: 20±10 µm
- Porosity: 60 %
- Adhesion strength: ≥ 15 MPa
- Ca/P ratio: 1.1±0.1
- Phase composition: ≥ 70 % Brushite/≤ 30 % HA
- Complete resorption within a short period of time
(6-12 weeks postoperatively)
